TOKYO – WEBWIRE – Tuesday, October 19, 2021
Nikon Company (Nikon) announced it’s miles currently developing the next-generation NSR-S636E ArF immersion scanner, that can bring superior overlay accuracy and ultra-excessive throughput to enhance manufacturing of essentially the most severe semiconductor devices. Product gross sales are scheduled to originate up in 2023.
Because the digital transformation (DX) accelerates, there would possibly perchance be an wanted must task and keep in touch immense volumes of recordsdata very hasty. High-efficiency semiconductors are imperative to meet these requirements, and semiconductor instrument technology is progressing with a simultaneous point of interest on circuit sample miniaturization as effectively as three-dimensional (3D) instrument structure development.
The NSR-S636E functions an enhanced inline Alignment Residing, or iAS, which is a wafer pre-measurement module built-in between the coater/developer unit and the lithography scanner. The S636E and iAS originate essentially the most of sophisticated multi-point alignment measurement and excessive inform correction functions that enable instrument makers to enact the stringent overlay accuracy indispensable for 3D instrument buildings, whereas moreover maximizing immersion scanner productivity. The NSR-S636E is effectively-suited to chopping-edge semiconductor manufacturing including good judgment and memory devices, CMOS describe sensor purposes and more.
Nikon is committed to providing industry-leading lithography solutions like the NSR-S636E immersion scanner that enable customers to come semiconductor manufacturing and help force the digital transformation.
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